Cooling, connected.
Explore thermal architecture from rack to server to component.
One rack.
A connected system.
Server, power and cooling interfaces considered together, from the compute hardware to the facility connection.
Complete thermal management
Server. Power. CDU.
Two-phase cold plates, coolant distribution, AI-enabled system controls and heat rejection come together in one engineering package.
- Server
- Cooling interfaces for GPU, CPU, memory and other heat sources.
- Power
- Power-shelf placement within the illustrated rack layout.
- CDU
- Circulation, condensation and controls for the cooling loop.
Illustrative architecture — not actual equipment or a validated circuit.
Illustrative rack layout · configuration is project-specific.
CP04Separate component reference · image IDs, not product models.
Architecture and image references for discussion. No model, rating or validated circuit is specified.
Select an interface, explore its role and move closer to the hardware.
View the hardwareTwo-phase cooling.
At the heat source.
Microjet-assisted liquid distribution, low-resistance fluidic channels and micro/nano-structured surfaces support embedded cooling development.
- 6,000 W
- Single-plate capability
- < 0.0065 K/W
- At selected operating points
- > 300 W/cm²
- Reported heat flux
These figures are not a single guaranteed operating point or a rating for every configuration. Confirm the working fluid, heat source and test conditions for your application.
Follow the two-phase loop.
From liquid circulation and flow boiling at the cold plate to condensation and heat rejection.
Generic pumped-loop principle, not a product design or performance simulation. Control and protection devices are omitted; the diagram is not to scale.
Laboratory hardware.
CP04
Rectangular copper component
Reviewed laboratory image. Geometry, packaging and connection features for project discussion.
Photo-based retouch review drafts; not dimensional references.
CP numbers identify images, not assigned product models.
Chip to chassis.
Four layers bring thermal and mechanical design together.
- Upper cover
- Protective metal cover
- Backside cooling
- Copper tubing and contact plates
- GPU motherboard
- PCB shown with rear components facing up
- GPU die cooling
- Lower module with two copper interfaces
The CDU system
for the endless loop.
Two-phase CDU engineering connects thermofluid design, monitoring and AI-enabled controls around the complete thermal load.
Thermal & hydraulic design
Thermal load, operating conditions, pump and coolant selection, condenser matching, two-phase flow control, heat rejection and leak detection.
Operating logic
Multichannel temperature, pressure, flow rate, void fraction and efficiency monitoring, with AI-enabled control development for continuous operation.