ENTHALUX

Engineering
at system scale.

Heat-transfer research, mechanical integration and controls within one development program.

Copper laboratory component with machined contact geometry
Laboratory hardware reference · photo-based retouch

Define the
thermal boundary.

Heat-load definition, thermofluid modelling and system sizing establish the development requirements.

Cold-plate geometry, package interfaces and coolant distribution are then considered in the context of the complete system.

Concept illustrations only. Generic geometry, not Enthalux product CAD, CFD or measured performance.

One engineering
program.

Each design decision connects to a physical interface and a system requirement.

Cold-plate development
Microchannels, microjets and nanocoating, with package-level mechanical integration.
CDU engineering
Circulation, condensation, fluid inventory, control algorithms and facility interfaces.
System integration
Server and rack distribution, parallel branches and controls.
Manufacturing coordination
Partner production, assembly coordination and delivery.
Laboratory compute assembly with copper cooling interfaces
Component integration · laboratory assembly reference
ENTHALUX rack-mounted CDU in front and closed-chassis three-quarter views
Rack-mounted CDU · AI-edited product illustration

PRODUCT APPLICATIONS

Thermal engineering.
Across industries.

Explore application areas for thermal-management development, from ground-based infrastructure to space computing.

Data centers

Thermal management for high-density servers, AI accelerators and rack-level computing systems.

New energy

Cooling considerations for battery systems, energy storage and power conversion equipment.

Robotics

Compact thermal design for motor drives, controllers and onboard computing.

Power systems

Heat management for power electronics, converters and electrical infrastructure.

Aerospace & aviation

Thermal design for avionics, onboard electronics and demanding operating environments.

Space computing

Thermal-management concepts for orbital computing payloads and space-based processing.

Medical technology

Temperature management for medical electronics, imaging equipment and precision instruments.

Each application starts with its own heat loads, operating environment and integration requirements.

Built. Measured.
Refined.

Instrumented loops connect design decisions to measured system behavior.

Laboratory cooling component reference with connection interfaces
Laboratory component reference

Thermal performance

Temperatures under defined heat loads.

Flow distribution

Pressure losses and parallel operation.

System response

Hardware and control refinement.

What defines a useful validation result?

Heat-source geometry and power map, working fluid and inlet conditions, flow and pressure measurements, temperature measurement methods, operating range and uncertainty.

Performance depends on the configuration and operating conditions. Discuss the test boundary for your application.

Ready for the
next interface?

Discuss your application