Data centers
Thermal management for high-density servers, AI accelerators and rack-level computing systems.
Heat-transfer research, mechanical integration and controls within one development program.

Heat-load definition, thermofluid modelling and system sizing establish the development requirements.
Cold-plate geometry, package interfaces and coolant distribution are then considered in the context of the complete system.
Concept illustrations only. Generic geometry, not Enthalux product CAD, CFD or measured performance.
Each design decision connects to a physical interface and a system requirement.


PRODUCT APPLICATIONS
Explore application areas for thermal-management development, from ground-based infrastructure to space computing.
Thermal management for high-density servers, AI accelerators and rack-level computing systems.
Cooling considerations for battery systems, energy storage and power conversion equipment.
Compact thermal design for motor drives, controllers and onboard computing.
Heat management for power electronics, converters and electrical infrastructure.
Thermal design for avionics, onboard electronics and demanding operating environments.
Thermal-management concepts for orbital computing payloads and space-based processing.
Temperature management for medical electronics, imaging equipment and precision instruments.
Each application starts with its own heat loads, operating environment and integration requirements.
Instrumented loops connect design decisions to measured system behavior.

Temperatures under defined heat loads.
Pressure losses and parallel operation.
Hardware and control refinement.
Heat-source geometry and power map, working fluid and inlet conditions, flow and pressure measurements, temperature measurement methods, operating range and uncertainty.
Performance depends on the configuration and operating conditions. Discuss the test boundary for your application.