Cooling
high-power computing.
Complete thermal management for AI infrastructure. Two-phase cold plates, CDUs, AI-enabled controls and integrated systems, developed together.
Explore our solutionsOne rack.
A connected system.
Server, power and cooling interfaces considered together, from the compute hardware to the facility connection.
Complete thermal management
Server. Power. CDU.
Two-phase cold plates, coolant distribution, AI-enabled system controls and heat rejection come together in one engineering package.
- Server
- Cooling interfaces for GPU, CPU, memory and other heat sources.
- Power
- Power-shelf placement within the illustrated rack layout.
- CDU
- Circulation, condensation and controls for the cooling loop.
Thermal engineering.
At system scale.
Enthalux develops thermal management solutions for AI data centers and high-performance computing.
Illustrative separation; not engineering CAD.
Four layers. One assembly.
Explore the protective cover, backside cooling, GPU motherboard and lower cooling module.
Assembly reference and layered visualization use different views.
Meet EnthaluxEngineering
through delivery.
Thermal design connects to hardware, validation and a coordinated production route.
Heat-load definition, thermofluid modelling and system sizing.
Cold platesMicrochannels, microjets and nanocoating, with package-level mechanical integration.
CDU engineeringCirculation, condensation, fluid inventory, control algorithms and facility interfaces.
System integrationServer and rack distribution, parallel branches and controls.
Precision from
chip to chassis.
GPU die cooling, backside heat removal and mechanical protection are considered as one integrated assembly.
Explore component design
Working together.
Across the thermal-management ecosystem.
Let’s talk
thermal.
Thermal management for AI infrastructure.