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Engineering-led thermal management, designed for high-power computing.
COMPANY INTRODUCTION
Enthalux develops thermal management solutions for AI data centers and high-performance computing.
Enthalux brings together thermal engineering, system integration and manufacturing collaboration to address the cooling demands of modern computing. From two-phase cold plates and coolant distribution units to intelligent controls and heat rejection, we develop connected solutions around each project’s requirements. By coordinating component development, partner production and assembly, we help customers move from thermal concepts toward practical cooling systems for AI data centers and high-performance computing.

CORE TECHNICAL TEAM
The people behind our thermal-management engineering.
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Technical expertiseExpertise to be added
Profile to be added: technical background, engineering experience and role in the team.
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Position to be added
Technical expertiseExpertise to be added
Profile to be added: technical background, engineering experience and role in the team.
Email to be added
Position to be added
Technical expertiseExpertise to be added
Profile to be added: technical background, engineering experience and role in the team.
Email to be added
Position to be added
Technical expertiseExpertise to be added
Profile to be added: technical background, engineering experience and role in the team.
Email to be added
Position to be added
Technical expertiseExpertise to be added
Profile to be added: technical background, engineering experience and role in the team.
Email to be added
Component development and partner production are coordinated around the project requirements.

SPARKLE
The complete two-phase cooling system for SPARKLE’s Intel Arc server includes 16 GPU chips, 2 CPU chips, memory and other heat sources, together with the CDU and control system. Reported thermal load is close to 20 kW per server.
FOXCONN
Cold-plate samples submitted for customer evaluation. At the reported 6,000 W test condition, Tcase is below 85°C and thermal resistance is as low as 0.0065 K/W.
Project-specific reported results; operating conditions and measurement boundaries must be confirmed for each application.
Across the thermal-management ecosystem.